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RAK3272S STM32WLE5CC Based RAK3172 LoRawan module Breakout Board

DWM23051901

RAK3272S Breakout Board is specifically designed to allow easy access to the RAK3172 low power long range LoRawan module  the board in order to simplify development and testing.

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$16.50
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Description

Product Description

RAK3272S Breakout Board is specifically designed to allow easy access to the RAK3172 low power long range LoRawan module the board in order to simplify development and testing.The breakout board footprint is based on XBee form factor and its main purpose is to allow the RAK3172 stamp module pins to be transferred to 2.54 mm headers. Its firmware is based on RAKwireless Unified Interface V3 (RUI3) that allows you create different functionalities using RUI APIs.

The board itself has the RAK3172 at its core, integrating a STM32WLE5CC chip, It has Ultra-Low Power Consumption of 1.69uA in sleep mode

This module complies with Class A, B & C of LoRaWAN 1.0.3 specifications. It also supports LoRa Point to Point (P2P) communication mode which helps you in implementing your own customized long-range LoRa network quickly.

Product Features

Based on RAK3172

I/O ports: UART/I2C/GPIO/SPI

Serial Wire Debug (SWD) interface

Module size: 25.4 x 32.3 mm

Supply Voltage: 2.0 V ~ 3.6 V

Temperature Range: -40° C ~ 85° C

Product Inclusion

1pc RAK3272S Breakout Board

1pc LoRa® antenna with RP-SMA female connector

18pcs Dupont lines

Useful Link:

Datasheet

AT Command Manual

Quick Start Guide

Product Details
DWM23051901
150 Items
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RAK3272S STM32WLE5CC Based RAK3172 LoRawan module Breakout Board

RAK3272S Breakout Board is specifically designed to allow easy access to the RAK3172 low power long range LoRawan module  the board in order to simplify development and testing.

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